Dissolution guided wetting of structured surfaces
US11566213B2 · kind B2 · utility
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22References
23Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 29, 2019 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Aug 2, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2035/00158
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microfabricated device having at least one gas-entrapping feature formed therein in a configuration that entraps air bubbles upon wetting the feature with a solvent or solution is described. The device includes a sacrificial residue in contact with the gas-entrapping feature, the dissolution of which guides the wetting of the gas-entrapping feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.