Patent · US Active

Sensor assembly and method for producing a sensor assembly

US11567098B2 · kind B2 · utility

0Cited by

4References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Mathias Elzner · Erfurt, DE
Thomas Ullmann · Arnstadt, DE

Key dates

Filing date	Oct 19, 2018
Grant date	Jan 31, 2023
Priority date	—
Expiry date	Mar 28, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01P3/487
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor assembly comprising a holder body and a housed semiconductor sensor element situated on the holder body for rotational speed measurement and/or position measurement, a cured enveloping material that covers the housed semiconductor sensor element completely being situated on the holder body. It is provided that the housed semiconductor sensor element is glued onto a mounting surface of the holder body using an adhesive that differs from the enveloping material, and that the adhesive is situated in a receiving space between the mounting surface and a bottom side of the housed semiconductor sensor element that is facing the mounting surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.