Photonics chips with ambient light shadowing of optical components
US11567260B1 · kind B1 · utility
0Cited by
2References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 14, 2021 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Oct 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/413
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Structures including an optical component and methods of forming a structure including an optical component. The structure includes an optical component on a substrate, and a back-end-of-line stack including multiple metal levels. Each of the metal levels includes a dielectric layer and metal features positioned over the optical component as metal fill in the dielectric layer. The metal features in at least two of the metal levels are arranged to overlap such that the optical component is fully covered normal to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.