Patent · US Active

Optical fiber-to-chip interconnection

US11567273B2 · kind B2 · utility

2Cited by
21References
30Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 28, 2022
Grant dateJan 31, 2023
Priority date—
Expiry dateMar 28, 2042

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/4249
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Provided is a connector assembly for optically connecting one or more optical fibers and an array of vertical coupling elements of a photonic integrated circuit (PIC). In various embodiments, the connector assembly is constructed to independently optically scale some feature sizes, such as, for example, the transverse mode size, the array size, the array geometry, and/or various incidence angles, the optical scaling being performed, e.g., from a fiber end face plane to a connector-mating plane and further to a PIC coupling plane. In some embodiments, the connector assembly may support a polarization (de)multiplexing functionality.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.