Systems, methods and file format for 3D printing of microstructures
US11567474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2021 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Mar 24, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
Systems, methods, and new file formats are provided for printing 3D microstructures. In some implementations, a new file format is provided that defines 3D objects by a wireframe model expressed as a collection of wires. Because wires and their parameters are defined within the new file format, objects may be processed more efficiently and quickly to support 3D rendering operations. Such methods may be used to print new articles, such as eyelashes, bushes, swabs and other novel items.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.