Touch panel and manufacturing method thereof
US11567599B1 · kind B1 · utility
0Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2021 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Oct 22, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A touch panel and a manufacturing method of the touch panel are provided. The touch panel includes a touch circuit board, a cover plate and a glue layer. The glue layer is arranged between the touch circuit board and the cover plate to bond the touch circuit board and the cover plate. The glue layer contains an epoxy resin main agent and an epoxy resin hardener.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.