Automated supervision and inspection of assembly process
US11568597B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2019 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Jul 26, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for performing automated supervision and inspection of an assembly process. The method is implemented using a computer system. Sensor data is generated at an assembly site using a sensor system positioned relative to the assembly site. A three-dimensional global map for the assembly site and an assembly being built at the assembly site is generated using the sensor data. A current stage of an assembly process for building an assembly at the assembly site is identified using the three-dimensional global map. A context for the current stage is identified. A quality report for the assembly is generated based on the three-dimensional global map and the context for the current stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.