Patent · US Active

Sputtering target

US11569075B2 · kind B2 · utility

0Cited by

4References

15Claims

0Family size

Assignee

Plansee SE · AT

Inventors

Michael Eidenberger-Schober · Breitenwang, AT
Joerg Winkler · Ullersdorf, DE
Michael O'Sullivan · Reutte, AT

Key dates

Filing date	Sep 8, 2017
Grant date	Jan 31, 2023
Priority date	—
Expiry date	Apr 30, 2038

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB22F2998/10
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A sputtering target containing molybdenum and at least one metal from the group tantalum and niobium. The average content of tantalum and/or niobium is from 5 to 15 at % and the molybdenum content is greater than or equal to 80 at %. The sputtering target has at least a matrix with an average molybdenum content of greater than or equal to 92 at % and particles which are composed of a solid solution containing at least one metal from the group of tantalum and niobium, and molybdenum, with an average molybdenum content of greater than or equal to 15 at % and are embedded in the matrix. There is also described a method of producing a sputtering target.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.