Resin molding apparatus including release film feeder
US11569097B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2019 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Sep 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin molding apparatus including a release film feeder configured to feed a release film is provided. The release film feeder including a feeding roller around which the release film is wound, a gripper configured to grip an end portion of the release film fed from the feeding roller, a support table configured to support the release film fed by a horizontal movement of the gripper in an X direction, the support table configured to horizontally move at least one of in the X direction or in a Y direction perpendicular to the X direction, the X and Y directions defining a surface parallel to a surface of the support table, and a position detecting sensor on the support table and configured to detect position information of the release film may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.