Patent · US Active

Composite assembly of three stacked joining partners

US11569151B2 · kind B2 · utility

0Cited by

2References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Andreas Krutsch · Rottenburg am Neckar, DE
Christian Schiele · Budapest, HU
Erik Sueske · Reutlingen, DE
Juergen Zipprich · Aspenhausiedlung, DE
Thomas Suenner · Neustadt, DE

Key dates

Filing date	May 10, 2019
Grant date	Jan 31, 2023
Priority date	—
Expiry date	Sep 23, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/9221
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A composite assembly of three stacked joining partners, and a corresponding method. The three stacked joining partners are materially bonded to one another by an upper solder layer and a lower solder layer. An upper joining partner and a lower joining partner are fixed in their height and have a specified distance from one another. The upper solder layer is fashioned from a first solder agent, having a first melt temperature, between the upper joining partner and a middle joining partner. The second solder layer is fashioned from a second solder agent, having a higher, second melt temperature, between the middle joining partner and the lower joining partner. The upper joining partner has an upwardly open solder compensating opening filled with the first solder agent, from which, to fill the gap between the upper joining partner and the middle joining partner, the first solder agent subsequently flows into the gap.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.