Semiconductor device and method of manufacturing thereof
US11569176B2 · kind B2 · utility
1Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2017 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Mar 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising multiple encapsulating layers and multiple signal distribution structures, and a method of manufacturing thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.