Method for testing performance of thin-film encapsulation
US11569447B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Nov 25, 2019 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Dec 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for testing performance of thin-film encapsulation. Through different combination designs of film layers, lateral water vapor intrusion paths of various thin films or encapsulation structures are formed, thereby obtaining a means to inspect a lateral water vapor and oxygen barrier capacity of thin films and provide a highly effective inspection means for encapsulation of display panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.