Multilayer encapsulation, method for encapsulating and optoelectronic component

US11569479B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Sebastian Wittmann · Regensburg, DE
• Arne Fleissner · Regensburg, DE
• Erwin Lang · Regensburg, DE

Key dates

• Filing date: Jun 1, 2021
• Grant date: Jan 31, 2023
• Expiry date: Aug 6, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K2102/351

Abstract

A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.