Patent · US Active

Pressure features to alter the shape of a socket

US11569596B2 · kind B2 · utility

0Cited by

1References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Steven A. Klein · Chandler, US
Kuang Liu · Queen Creek, US
Srikant Nekkanty · Chandler, US
Feroz Mohammad · Chandler, US
Donald T. Tran · Phoenix, US
Srinivasa R. Aravamudhan · Beaverton, US
Hemant Mahesh Shah · Hillsboro, US
Alexander HUETTIS · Beaverton, US

Key dates

Filing date	Mar 27, 2020
Grant date	Jan 31, 2023
Priority date	—
Expiry date	Jul 31, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01R43/04
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.