High electric-thermal performance and high-power density power module
US11569815B1 · kind B1 · utility
0Cited by
4References
14Claims
0Family size
Inventors
Key dates
| Filing date | Oct 15, 2020 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Jan 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A rectangular power module with a body having two short ends defining a length and two long sides defining a width having three parallel circuit paths crossing the short width distance from side to side using side positioned gate terminals and planar top positioned top power terminal positioned between MOSFETS in the circuit for even thermal positioning and reduced current path, inductance, and resistance and increased power density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.