Circuit board device
US11570886B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 22, 2022 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Feb 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09609
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board device includes a multilayer structure, a main ground area and a circuit module. The multilayer structure includes a plurality of plates. The main ground area is arranged in the multilayer structure. The circuit module includes a differential signal circuit and a surrounding circuit module. The differential signal circuit is located in the multilayer structure, and includes a positive signal pad and a negative signal pad. The positive signal pad is located on a configuration surface of one of the plates. The negative signal pad is located on the disposition surface, and is separated from the positive signal pad. The surrounding circuit module is located on the disposition surface, and electrically connected to the main ground area. The surrounding circuit module surrounds the positive signal pad and the negative signal pad in an enclosing way, and is physically separated from the differential signal circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.