On-board integrated enclosure for electromagnetic compatibility shielding
US11570887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Mar 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelop an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelop a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.