Through-hole and surface mount printed circuit card connections for improved power component soldering
US11570894B2 · kind B2 · utility
0Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2021 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | May 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1031
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.