Determining the thickness profile of work products
US11570998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Jul 1, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30128
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A processing system (10) and a corresponding method are provided for processing work products (WP), including food items, to locate and quantify voids, undercuts and similar anomalies in the work products. The work products are conveyed past an X-ray scanner (14) by a conveyance device (12). Data from the X-ray scanning is transmitted to control system (18). Simultaneously with the X-ray scanning of the work product, the work product is optically scanned at the same location on the work product where X-ray scanning is occurring. The data from the optical scanner is also transmitted to the control system. Such data is analyzed to develop or generate the thickness profile of the work product. From the differences in the thickness profiles generated from the X-ray scanning data versus the optical scanning data, the location of voids, undercuts and similar anomalies can be determined by the control system. This information is used by the processing system (10) to process the work product as desired, including adjusting for the locations and sizes of voids, undercuts and similar anomalies present in the work product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.