Wafer cleaning apparatus and wafer cleaning method
US11571717B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 8, 2021 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | May 8, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer cleaning apparatus includes: a brush, configured to wash a surface to be cleaned of a wafer; a base for carrying the brush, the base having at least one conductive disk, a disk surface of the conductive disk being parallel to the surface to be cleaned, and the base being able to rotate around an axis of the base; and a magnetic field generation structure configured to emit, to the conductive disk, a magnetic field perpendicular to the disk surface of the conductive disk, so that an induced electric field is generated in the conductive disk during the rotation of the base. The quality of wafer cleaning and the yield of wafer products can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.