Thermoplastic molding compounds

US11572463B2 · kind B2 · utility

Assignee

• CLARIANT INTERNATIONAL LTD · CH

Inventors

• Jeremia SCHWABE · Augsburg, DE
• Erik HAUCK · Gersthofen, DE
• Simon Bodendorfer · Augsburg, DE
• Sebastijan Bach · Marktoberdorf, DE
• Matthias Roessle · Reutern, DE
• Torsten Lindner · Schwalbach am Taunus, DE
• Robert Haines Turner · Cincinnati, US
• Christian Neu · Eppstein, DE
• Matthias Morand · Bad Soden, DE
• Gabriele Stiehl · Schwalbach, DE

Key dates

• Filing date: Jul 24, 2019
• Grant date: Feb 7, 2023
• Expiry date: Oct 27, 2039

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2314/06
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to thermoplastic molding compounds having melt viscosities of less than 30,000 mPas for use as a hot-melt adhesive, comprising the components A and B, wherein component A comprises one or more C3/C2 copolymers each produced with metallocene catalysts and each having a melt viscosity at 170° C. of less than 20,000 mPas, measured according to DIN 53019, and a molecular weight MW of 1000 g/mol to 50,000 g/mol, and component B comprises one or more C2/C3 copolymers each produced with metallocene catalysts and each having a melt flow index MI of 1 to 100 g/m in, measured at 190° C./2.16 kg, according to ASTM D 1238, and a molecular weight MW of 50,000 g/mol to 300,000 g/mol. Said thermoplastic molding compounds, because of the viscosity and mechanical properties thereof, are suitable for fiber mesh applications.