Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set
US11572467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Apr 22, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/37
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.