Vibration isolator and method of assembly using flex circuits
US11572929B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | May 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2045
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.