Vapor chamber and means of attachment

US11573055B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Juha Paavola · Hillsboro, US
• Mark Carbone · Verplanck, US
• Vivek Paranjape · Hillsboro, US
• Prakash Kurma Raju · Bengaluru, IN
• Mikko Makinen · Santa Clara, US
• Christopher Michael Moore · Racine, US
• Gustavo Fricke · San Jose, US
• Kathiravan D · Kanchinakote, IN
• Ritu Bawa · Kanchinakote, IN
• Nehakausar Shaikh Ramjan Pinjari · Kanchinakote, IN
• Hari Shanker Thakur · Kanchinakote, IN

Key dates

• Filing date: Dec 27, 2019
• Grant date: Feb 7, 2023
• Expiry date: Jun 1, 2040

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F28F2240/00
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.