Heterogeneous spectroscopic transceiving photonic integrated circuit sensor
US11573123B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2021 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Dec 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/026
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Described herein are optical sensing devices for photonic integrated circuits (PICs). A PIC may comprise a plurality of waveguides formed in a silicon on insulator (SOI) substrate, and a plurality of heterogeneous lasers, each laser formed from a silicon material of the SOI substrate and to emit an output wavelength comprising an infrared wavelength. Each of these lasers may comprise a resonant cavity included in one of the plurality of waveguides, and a gain material comprising a non-silicon material and adiabatically coupled to the respective waveguide. A light directing element may direct outputs of the plurality of heterogeneous lasers from the PIC towards an object, and one or more detectors may detect light from the plurality of heterogeneous lasers reflected from or transmitted through the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.