Patent · US Active

Far infrared sensor apparatus having multiple sensing element arrays inside single package

US11573127B2 · kind B2 · utility

1Cited by

3References

4Claims

0Family size

Assignee

PIXART IMAGING INC. · TW

Inventors

Chih-Ming Sun · New Taipei, TW
Sen-Huang Huang · Baoshan, TW

Key dates

Filing date	Mar 6, 2019
Grant date	Feb 7, 2023
Priority date	—
Expiry date	Jun 13, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01J2005/123
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.