Positive-type photosensitive resin composition and cured film prepared therefrom
US11573490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | May 20, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0757
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.