Multi-stage provisioning of secret data
US11574079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2021 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | May 27, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F21/107
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for provisioning an electronic device includes providing a semiconductor wafer on which multiple integrated circuit (IC) chips have been fabricated. Each chip includes a secure memory and programmable logic, which is configured to store at least two keys in the secure memory and to compute digital signatures over data using the at least two keys. A respective first key is provisioned into the secure memory of each of the chips via electrical probes applied to contact pads on the semiconductor wafer. After dicing of the wafer, a respective second key is provisioned into the secure memory of each of the chips via contact pins of the chips. A respective provisioning report is received from each of the chips with a digital signature computed by the logic using both of the respective first and second keys. The provisioning is verified based on the digital signature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.