Multilayer electronic component
US11574773B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2021 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Oct 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.