Die attach systems including a verification substrate
US11574832B2 · kind B2 · utility
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1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2019 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Oct 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.