Electronic device and method of manufacturing electronic device
US11574897B2 · kind B2 · utility
1Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Feb 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.