Image sensor modules including primary high-resolution imagers and secondary imagers
US11575843B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Jan 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/56
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.