Infrared image sensor and infrared camera module
US11575845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2021 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Aug 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F30/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.