Multilayer screen printing stencil
US11576266B2 · kind B2 · utility
0Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Oct 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.