Laser shock strengthening method for small-hole components with different thicknesses
US11578384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2017 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Nov 15, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D2221/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a laser shock processing method for small-hole component with different thickness. In this method, different process parameters are adopted for laser shock processing of small hole members with different thicknesses, and the empirical formula was obtained by statistical analysis of the experimental results, and the empirical formula is the relationship between power density and thickness of small hole members. According to this formula, the power density of laser shock strengthening of orifice member with different thickness is determined, and the selection and determination method of process parameters related to this is put forward. According to this method, reasonable residual compressive stress distribution can be obtained after laser shock strengthening with appropriate technology, and good strengthening effect can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.