Electronic IC device comprising integrated optical and electronic circuit component and fabrication method
US11581249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2020 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | May 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/95
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first circuit structure of an electronic IC device includes comprises light-sensitive optical circuit components. A second circuit structure of the electronic IC device includes an electronic circuit component and an electrically-conductive layer extending between and at a distance from the optical circuit components and the electronic circuit component. Electrical connections link the optical circuit components and the electronic circuit component. These electrical connections are formed in holes which pass through dielectric layers and the intermediate conductive layer. Electrical insulation rings between the electrical connections and the conductive layer are provided which surround the electrical connections and have a thickness equal to a thickness of the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.