Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus
US11581478B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2017 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jun 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N39/00
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.