Thin film packaging structure and display panel
US11581508B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 13, 2020 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jul 13, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This disclosure relates to the field of display technologies and, in particular to a thin film packaging structure and a display panel. A thin film packaging structure includes a first inorganic packaging layer for covering a device to be packaged; an organic packaging layer formed at a side of the first inorganic packaging layer; a second inorganic packaging layer formed at a side of the organic packaging layer facing away from the first inorganic packaging layer; and at least one first inorganic adjusting layer formed at a side of the first inorganic packaging layer facing away from the device to be packaged. The at least one first inorganic adjusting layer has an elasticity modulus greater than that of the first inorganic packaging layer or the second inorganic packaging layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.