Camera module with improved heat dissipation function and electronic device
US11582369B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2021 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jun 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0264
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The camera module with improved heat dissipation function include a base, a photosensitive chip, a circuit board; and a heat conducting sheet. Wherein the base comprises a first surface and a second surface opposite to the first surface. A portion of the first surface is recessed to form a third surface between the first surface and the second surface, and to form a plurality of sidewalls connecting the first surface and the third surface, the third surface and the plurality of sidewalls cooperatively define a slot. Wherein the photosensitive chip is fixed on the third surface and accommodated in the slot; the circuit board is fixed on the first surface. A gap is defined between the circuit board and the photosensitive chip; the heat conducting sheet is disposed in the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.