Circuit board with heat dissipation function and method for manufacturing the same
US11582871B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 23, 2021 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jul 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09054
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.