Attachment mechanism for tire-mounted sensors
US11584172B2 · kind B2 · utility
0Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2020 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Apr 15, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D2030/0072
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An assembly for mounting an electronics package to a tire includes an electronics package, a mount with a peripheral flange, and an attachment patch. The electronics package is connected to the mount, which is in contact with the tire. The attachment patch is connected to the mount and includes a central opening that it smaller than the peripheral flange. The attachment patch is further affixed to the tire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.