Fairing bond fixture
US11584547B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2021 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Apr 8, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64F5/40
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A bond fixture includes a support structure and a first assembly coupled to the support structure. The first assembly includes a frame defining a chamber and a first pressure pad and second pressure pad coupled to the frame opposite one another and positioned within the chamber. The second pressure pad is movable to control a pressure applied by the first pressure pad and the second pressure pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.