Silicon material and method of manufacture
US11584653B2 · kind B2 · utility
4Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2021 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Nov 12, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A silicon material can include a composition with at least about 50% silicon, at most about 45% carbon, and at most about 10 % oxygen. The silicon material can have an external expansion that is less than about 40%. The silicon material can include silicon nanoparticles, which can cooperatively form clusters. The silicon nanoparticles can be porous.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.