High temperature-heat insulator and method for manufacturing three-dimensionally shaped insulator thereof
US11585084B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jul 3, 2019 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Jul 3, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a heat insulator comprising a substrate comprising of a bulk of silica-based inorganic fiber containing a hydroxyl group; a metallic or ceramic infrared mediator held on at least a part of one surface of the substrate; and a silica cured product holding the infrared mediator on/in the substrate. As the infrared mediator, a metal foil or a ceramic particle may be used. This heat insulator exhibits excellent heat insulating performance in a high temperature range of 600° C. or more, and can be molded into a three-dimensional shape which can be directly mounted to a structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.