Imaging device, bump inspection device, and imaging method
US11585652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2017 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Jul 28, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bump inspection device images a wafer that includes a plurality of bumps arranged in parallel to each other. Each of the bumps is elongated along a first direction that is along a substrate surface. The bump inspection device includes: a laser-light source that emits laser light in a direction that is inclined relative to the substrate surface; a camera that images the substrate surface onto which the laser light is emitted; and a direction adjusting portion that adjusts an arrangement relation between the direction in which the laser light is emitted and an orientation of the wafer to allow the first direction to become inclined relative to the direction in which the laser light is emitted, in a plan view. The camera images the wafer while the first direction is inclined relative to the direction in which the laser light is emitted, in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.