Patent · US Active

Modular printed circuit board enclosure

US11586795B2 · kind B2 · utility

0Cited by

2References

9Claims

0Family size

Assignee

The Government of the United States of America, as represented by the Secretary of the Navy · US

Inventors

Blerta Markowski · Springfield, US
Brian Hicks · Melbourne, US
David Bonanno · Fairfax Station, US
Freddie Santiago · Albuquerque, US

Key dates

Filing date	Jan 15, 2021
Grant date	Feb 21, 2023
Priority date	—
Expiry date	Jan 15, 2041

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P90/30
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Systems and methods are provided for a turnkey modular printed circuit board enclosure that is generated using a template generator. The template generator accepts a user input comprising an enclosure parameter, based on which a manufacturing file may be generated. The manufacturing file may be provided to a fabricator for fabricating the enclosure or the manufacturing file may be modified in a printed circuit board design environment to incorporate a printed circuit board into the enclosure. The printed circuit board may be a separate printed circuit board that is inserted into the enclosure or it may be embedded in a face of the enclosure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.