Patent · US Active

Business form and methods of making and using same

US11587470B1 · kind B1 · utility

1Cited by
175References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 30, 2019
Grant dateFeb 21, 2023
Priority date
Expiry dateMay 12, 2041

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/10
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A business form comprises a first portion and a second portion adhesively secured to the first portion via a control bond adhesive. The control bond adhesive is a mixture comprising: between about 1 kg and 2 kg of a flexible adhesive; between about 1 kg and 2 kg of water; between about 12 g and 16 g gypsum, and between about 13 g and 23 g fumed silica.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.