Wafer scanning apparatus and method for focused beam processing
US11587760B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2020 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Jan 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/20228
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A scanning system includes a scanning chamber; a first rotary drive disposed in the scanning chamber and configured to rotate around a first axis; a second rotary drive disposed in the scanning chamber and configured to rotate around the first axis synchronously with the first rotary drive; and a bar-and-hinge system disposed in the scanning chamber and mechanically coupled to a substrate holder, the hinge system configured to translate a rotary motion of the first rotary drive and the second rotary drive to a planar motion of the substrate holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.