Megapixel-resolution photonic integrated circuit based imager
US11587967B1 · kind B1 · utility
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3References
16Claims
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Key dates
| Filing date | Apr 5, 2019 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Aug 3, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12138
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic integrated circuit (PIC)-based imager blade includes a number of PIC imager units stacked on top of one another. Each PIC imager unit includes a PIC coupled, at a first end and a second end, to a first set of lenslets and a second set of lenslets, respectively. An electronic integrated circuit (EIC) is coupled to the PIC. Pairs of lenslets of the first and second set of lenslets are optically coupled to respective waveguides embedded in the PIC. The PIC imager units have different lengths, and longer PIC imager units include larger lenslets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.