Encapsulation layer structure for display panel, method of manufacturing display device and display panel
US11588134B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2020 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Dec 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8052
Abstract
The present application discloses a display panel, a method of manufacturing the display panel and a display device. A display panel, including: a display substrate having a display area and a non-display area, the display substrate including a substrate; a dam on the upper surface of the non-display area of the display substrate; and an encapsulation layer covering the display substrate, wherein the encapsulation layer includes an organic layer, the upper surface of the non-display area of the display substrate is further provided with an isolation column, and a distance between the isolation column and the display area is smaller than a distance between the dam and the display area, the isolation column is at least partially in contact with the organic layer, and the dam is at least partially not in contact with the organic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.